• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    ELECTRONIC MODULE containing a printed circuit board with leadless functional elements mounted on the installation sites of the printed circuit board by means of an adhesive joint, characterized in that, in order to increase reliability, each installation position of the printed circuit board is provided with a dye layer located under the adhesive layer, which is made of epoxy-acrylate group with pigment additives in the amount of 1-5%, contrasting and dye layer.
    公开号:SU1123556A3
    申请号:SU802912762
    申请日:1980-04-25
    公开日:1984-11-07
    发明作者:Озава Мицуи
    申请人:Сони Корпорейшн (Фирма)；
    IPC主号:
    专利说明:

    SP
    Yu
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    a: 1 The invention relates to an electronic circuit device formed on a printed circuit board, to which leadless circuit elements are pre-attached with glue. The closest to the invention in its technical nature is an electronic module design containing a printed circuit board with leadless functional elements fixed on the installation places of the printed lUjaTbi by means of adhesive bonding C. However, in this construction it is not possible to determine in the assembly process the adhesion of the adhesive to strictly designated places for pre-fixing of free functional elements. The aim of the invention is to increase reliability. The goal is achieved by the fact that in an electronic module containing a printed circuit board with lead-free functional elements mounted on the installation slots of a printed circuit board using an adhesive joint, each installation position of the printed circuit board is provided with a dye layer located under the adhesive layer which. Made of epoxy acrylate resin gritshy with pigment additives in the amount of 1 -5%, contrasting dye layer. FIG. 1 shows a variant of a free circuit element; in fig. 2 -. a device of electrical power, formed on a printed circuit board, a slit; on the flg. 3 printed circuit boards, partial top view. The metal tips of the 2 and 3 electrodes are attached to both cylinder blocks 1. In addition to the corresponding parts of the nozzles 2 and 3, there are no folding 2 and 3 and the material 1 is molded with resin 4. Thus, a no-functional functional element is obtained. 5. In the device of the electronic module A (Fig. 2), the lead-free functional element 5 is mounted on the printed circuit board 6 (Fig. 2), on which a pattern of copper foil 7 and 8 is formed, having pads 9 and 10, and an intersecting pattern and copper foil 11 and 12, which must intersect with the leadless element. 5 (Fig. 3). The printed circuit board 6 and the copper foil patterns 7, 8, .11 and 12 are covered with a solder-resistant film 13. The pads 9 and 10 remain open as electrodes. On resistant to solder. A pier 13 between pads 9 and 10 forms an pad 14 for glue with a predetermined thickness, which is used to pre-fix the leadless element 5. The place where glue is applied 15 is indicated by pad 14 for glue. For example, pad 14 for glue can be obtained by applying white paint. It also serves to improve the electrical insulation between the intersecting pattern of copper foil II and 12 and the continuous output element 5.. Installation of a leadless functional element 5. on printed circuit board 6, as follows. First, the glue pad 14 is coated with a predetermined amount of glue 15 by screen printing. As the adhesive 15, a light-cured resin or a thermosetting resin of the epoxy acrylic group is used. When a light-cured resin is used as the glue 15, the glue 15 is irradiated with a UV or electron beam for curing for several ceKj-nw or for ten seconds. Usually this type of glue is transparent. Consequently, in a short period of time it is difficult to discern with the naked eye whether the pad 14 is covered with glue, especially when many lead-free elements are installed on the printed circuit board 6 and the pad’s many sites must be covered with glue. In order to easily distinguish whether the pad 14 is coated with glue 15, the glue is sintered. For example, pigment can be used as a dye and glue 15. Approximately 1-5% of the pigment is mixed with glue 15. The glue can be light colored. When too much pigment is mixed with glue, its adhesive strength decreases. If light-cured resin is used as the glue 15, then a large amount of pigment reduces the light transmittance of the glue 15. The glue pad for glue usually has a white or some other bright color. The solder foil 13 has a dark zeleiun or any other color. To easily distinguish glue Ib from glue pad 14 and resistant to soldering iron HjieincH 13, the glue can be painted, for example, in a light red color. The painted glue 15 is applied to the pad 14 for glue, then it is placed on it and a pinion-free finstock 5 is pressed against it slightly. Then the glue 15 is detached. Thus, the leadless element 5 is pre-fixed on the printed circuit board 6. The printed circuit board 6 with the fixed leadless element 5 is immersed
    权利要求:
    Claims (1)
    [1]
    ELECTRONIC MODULE containing a printed circuit board with non-withdrawable functional elements fixed to the mounting locations of the printed circuit board using an adhesive joint, characterized in that, in order to increase reliability, each mounting location of the printed circuit board is provided with a dye layer located under the adhesive layer, which is made of resins of the epoxy acrylate group with pigment additives in an amount of 1-5%, a contrast and a dye layer.
    类似技术:
    公开号 | 公开日 | 专利标题
    SU1123556A3|1984-11-07|Electronic module
    DE69636335T2|2007-08-09|Integrated circuit package and method of assembly
    JPH04229692A|1992-08-19|Method for mounting ic on printed circuit board and device therefor
    CA1130012A|1982-08-17|Printed circuit board
    KR20020092254A|2002-12-11|Printing mask, method of printing solder paste using printing mask, surface-mounted structural assembly, and method of manufacturing surface-mounted structural assembly
    GB2151834A|1985-07-24|Liquid crystal display device
    GB2211667A|1989-07-05|Method for inspecting printed circuit boards for missing or misplaced components
    JPS5618448A|1981-02-21|Composite electronic part
    KR100219901B1|1999-09-01|Printed board and method for discrimination
    JP2872715B2|1999-03-24|Solder dip mask
    DE4108667C2|2000-05-04|Composite arrangement of a metallic base plate and a ceramic printed circuit board and method for their production
    EP0658074A1|1995-06-14|Assembly of a printed circuit board and at least one component, and method of fastening a component to a printed circuit board
    JPH0357295A|1991-03-12|Method of mounting electronic components on double-sided mounting board
    DE4118308A1|1992-12-10|Circuit board structure with surface mounted devices - has main and auxiliary boards adhered together via electrically insulating adhesive
    RU2130699C1|1999-05-20|Method for local mounting of semiconductor chip
    JPS5846659A|1983-03-18|Electronic circuit device
    KR910001141Y1|1991-02-25|Printed circuit board for magnetic head
    JPS5770082A|1982-04-30|Method for checking soldering and flux for checking
    JPH02260592A|1990-10-23|Circuit board
    JPH04151895A|1992-05-25|Mounting method on printed wiring boards
    JPH0390292A|1991-04-16|Solder paste
    JP2781062B2|1998-07-30|Surface treatment method for printed wiring board
    JPH10275962A|1998-10-13|Printed-wiring board and paper-, phenol-and copper-clad laminated board
    JPH0749825Y2|1995-11-13|Soldering structure for chip parts
    JPH03167890A|1991-07-19|Formation of printed wiring board unit
    同族专利:
    公开号 | 公开日
    FR2455421B1|1985-04-26|
    DE3014422A1|1980-11-06|
    NL8002399A|1980-10-28|
    GB2047973A|1980-12-03|
    FR2455421A1|1980-11-21|
    GB2047973B|1983-05-18|
    US4339785A|1982-07-13|
    CA1140662A|1983-02-01|
    JPS55156482U|1980-11-11|
    引用文献:
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP1979056331U|JPS55156482U|1979-04-26|1979-04-26|
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